HSP-ETXEXPRESS®-690 THROUGH - HSP-ETXexpress-690, through hole stand off, soldered CPU (BGA)

HSP-ETXexpress®-690 through - HSP-ETXexpress-690, through hole stand off, soldered CPU (BGA) Simple Type:...

HSP-ETXexpress-690, through hole stand off, soldered CPU (BGA) Simple Type: - TBD -

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General

Chipset: AMD M690E, SB600
Chipset Integrated: 3 PCI Express x1, 1x PEG x8 PCI 2.3, 32 bit / 33 MHz PCI bus
Environment: Temperature: operation: 0° to 60° C, storage: -10° to 85° C Humidity: operation: 10% to 90%, storage: 5% to 95% (non condensing)
Expansion BUS: 10/100/1000 Mbit Intel 827542
Form Factor / Pin-out Type: 125 x 95 mm Fully COM Express™ Type 2 compliant
Hard Disk: 4x SerialATA 300 (AHCI/ RAID 0,1,10); 1 x Parallel ATA 133
LVDS Panel Support: Resolutions: CRT: 2560 x 1440 @75Hz LVDS: 2048 x 1536 @ 60Hz Supports 480p, 720p and1080i Panel Support: Single and Dual Channel 18/24 bit
Max Data Transfer Rate: Up to 4 GB DDR2 (667/800) dual channel SODIMM memory
Operating Humidity: Windows Vista®, WinXP, WinXPe, Win CE, Linux
Other Features: Watchdog Timer, Suspend Modes (S1, S3, S4, S5), AMD PowerNow!™, AMD Cool‘n‘Quiet™
Power Requirement: typ. Idle 15W @ AMD Turion™ 64 X2 TL-62
Processor: AMD Turion™ 64 X2 TL-62 with 2,1GHz Dual Core Mobile AMD Sempron™ 2100+ with 1,0GHz Single Core
SATA: TPM 1.1 and 1.2 compliant (optional)
Serial: High Definition audio or AC97 support
USB: 8x USB 2.0
VRAM: Integrated ATI Radeon 3D graphics core X1200 Supports a TDMS interface enabling DVI or HDMI shared with PEG DirectX 9.0/SM2.0 and shared memory up to 1024MB Dual Independant Display Support